Cooler Master HTK-002-U1 High Performance Thermal Paste

Product Features

High Performance Thermal Compound: Cooler Master HTK-002-U1 is a thermal paste designed to improve thermal contact between compatible electronic components and their cooling solutions.

CPU Application: The thermal compound can be applied between a compatible desktop processor and CPU cooler to help provide effective heat transfer across the contact surfaces.

Mainboard Chipset Support: In addition to processors, the thermal paste is suitable for compatible motherboard chipsets requiring thermal compound between the chipset and cooling solution.

VGA Card Application: The compound can also be used with compatible VGA and graphics card cooling applications where thermal paste is required.

Grease-Like Silicone Material: Cooler Master uses a grease-like silicone compound that can be spread across the required contact area during installation.

Easy Application: ZIF socket templates help define the appropriate application area for different compatible CPU socket types.

Even Coverage: The supplied applicator helps spread the thermal compound into an even layer across the required surface.

Wide Temperature Range: The thermal paste is designed for use across a wide application temperature range, making it suitable for different computer cooling environments.

Cooling System Maintenance: Thermal paste can be used when installing or servicing compatible CPU coolers, graphics card cooling components and chipset cooling solutions.

Desktop PC Applications: The Cooler Master HTK-002-U1 is suitable for PC building, processor cooler installation and maintenance of compatible desktop computer cooling systems.

Product Specifications